Apta have developed a range of core technologies for commercial products including surface mount, chip on board, chip size package and single and multi die BGA.

All memory products are sold under the HMP brand name

Apta Group Ltd have a ISO9001 approved 11,500 sq ft facility housing all design, production engineering, test, QA and support functions to facilitate maximum control over the product development and manufacturing process. HMP have invested heavilly in test, screening and qualification equipment and associated engineering support.

Apta are packaging experts. Where size, aspect ratio, footprint or organisation of standard memory components present a problem Apta apply one or more core technologies to provide problem solving solutions. Apta design the product, manufacture, test and qualify to provide innovative products specific to customer requirements.

SUBSTRATE AND CERAMIC PACKAGE DESIGN : Long term design experience, design rules based on sound engineering judgement, carefully selected suppliers and a detailed understanding of PCB and co-fired ceramic capability and design limitations enables Apta to design very high density, high reliability substrates for a range of applications. Apta (formerly HMP (Europe Ltd) have over 15 years experience in ceramic package design and have a history of producing ceramic monolithic memory and innovative ceramic module packages.

CHIP SIZE PACKAGE : Apta have capability to package various memory die into plastic, commercial chip sized package to produce very high density monolithic solutions. A range of multi die based BGA solutions are currently in development to provide ultra high density 32 bit and 64 bit wide memory solutions with BGA footprint. These solutions may be offered as components or they may be used to produce innovative memory module solutions in a range of footprints.

MEMORY STACK TECHNOLOGY : A range of memory stack technologies are available including various die stacking technologies. Where height allows, these solutions may be employed to produce memory solutions which utilise minimal system board area.

OBSOLESCENCE MANAGEMENT : Apta have capability to manufacture both ceramic and plastic equivalents to devices made obsolete by other manufacturers. Subject to certain commercial conditions Apta may provide opportunities for customers to make last time buys of obsolete product thereby extending system life and avoiding re-design.